Semiconductor devices come in different packages and sizes. We present here a list of package definitions:
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BGA - Ball Grid Array CBGA - Ceramic Ball Grid Array CSP - Chip Scale Package DFN - Dual Flat No Lead DFP - Dual Flat Package DIL - Dual In-Line DIP - Dual In-Line Package EBGA - Enhanced Ball Grid Array FPBGA - Fine Pitch Ball Grid Array LCBGA - Low Cost Ball Grid Array LFBGA - Leadless Fine Pitch Ball Grid Array LGA - Land Grid Array LQFP - Low-Profile Quad Flat Package MLF - Micro Lead Frame MQFP - Metric Quad Flat Package MSOP - Mini Small-Outline Package PBGA - Plastic Ball Grid Array PFBGA - Plastic Fine Pitch Ball Grid Array PGA - Pin Grid Array PLCC - Plastic Leaded Chip Carrier PPGA - Plastic Pin Grid Array PQFP - Plastic Quad Flat Package PSOP - Plastic Small-Outline Package QFN - Quad Flat Package No Lead |
QFP - Quad Flat Package QIP - Quadruple In-Line Package QSOP - Quarter-Size Small-Outline Package SDIP - Shrink Dual In-Line Package SIP - Single In-line Package SOIC - Small-Outline Integrated Circuit SOP - Small Outline Package SOT23 - Small-Outline Transistor Plastic Package SQFP - Shrink Quad Flat Package SSOP - Shrink Small-Outline Package TFBGA - Thin-Profile Fine Pitch Ball Grid Array TQFN - Thin Quad Flat Package with No Lead TQFP - Thin Quad Flat Package TSOP - Thin Small-Outline Package TSQFP - Thin Shrink Quad Flat Package TSSOP - Thin Shrink Small-Outline Package TVSOP - Thin Very Small-Outline Package UBGA - Micro Ball Grid Array VQFN - Very Small Quad Flat No Pins VQFP - Very Thin Quad Flat Package VSOP - Very Small Outline Package VTQFP - Very Thin Quad Flat Package VTSOP - Very Thin Small Outline Package WSOP - Very Very Thin Small-Outline Package |